Gore EMI shielding materials available from Richardson Electronics

-- Test & Measurement World, 11/21/2008 1:20:00 PM

W.L. Gore & Associates has announced that their high-tech line of surface mountable EMI (electromagnetic interference) shielding materials will now be available through Richardson Electronics. Richardson, a provider of engineered solutions and global distributor of electronic components to the RF and wireless communications market and the industrial power conversion market, will now sell Gore-Shield Supersoft SMT EMI gaskets and grounding pads and the Gore snapSHOT board-level EMI shield.

Gore's shielding system will allow RF engineers to design complex RF circuits without being limited by bulky standardized shielding and grounding materials, according to Richardson.

To support customers’ evaluation and design-in of Gore’s EMI shielding products, Richardson stocks the entire product line as well as the Gore-Shield SMT EMI gaskets and grounding pad sample kit, which include samples, instructions and detailed specifications. 

Richardson and Gore are now celebrating more than 15 years together in a distribution relationship. Richardson began distributing Gore electronic products during the fall of 1993.

“Gore is the global leader in the design and manufacture of flexible RF shielding solutions for today’s smaller, more complex RF circuit designs. Gore EMI gasket materials allow OEM designers to use their existing surface mount manufacturing machines to pick and place the gasket or grounding pad that best fits their custom application,” says Michael Sobota, product specialist for SMT from Gore. “The combination of our innovative shielding products with Richardson’s service, support, and delivery capabilities provides our mutual clients with an initial time-to-market advantage for new designs and subsequently a cost-saving, rapid delivery supply chain solution once the design becomes a high-runner in the factory.”

W. L. Gore & Associates, www.gore.com/emi; Richardson Electronics, www.rell.com/gore.