Lithography at 32 nm: Finding the Right Solution
-- Semiconductor International, 10/3/2006 2:42:00 PM
Now Available On Demand
Originally broadcast November 30, 2006
VIEW ON DEMAND
New levels of both technical and economic challenges are making lithography's future far from certain. Although the apparent invincibility of optical lithography has become at least as certain as its sure demise, the technology does indeed seem to be finally approaching its limits. At the 32 nm half-pitch, it's still anyone's guess as to which technique will be most suited to the job. Will 193 nm immersion lithography be able to persevere — whether through high-index chemicals and lenses or through double patterning techniques? Will EUV lithography overcome sizable technology and cost issues to print high-volume wafers? Will nanoimprint lithography get the funding and momentum needed to make a run on the market? This webcast will gather a panel of experts from all the various camps to debate the probable outcome at future technology nodes.
Moderator:
 |
Aaron Hand Managing Editor Semiconductor International |
Panelists
 |
Kurt Ronse IMEC |
 |
Bryan Rice Sematech (Intel assignee) |
 |
Grant Willson University of Texas |
 |
Hank Smith Massachusetts Institute of Technology |
Webcast Sponsor
 |
Webcast Registration Policy
The participation of our sponsors in this webcast enables us to provide this event free of charge to our registrants. Part of the value we are able to provide our sponsors is information they can use to more effectively market their products and services. Accordingly, by registering for this webcast you are agreeing that we may share your registration information with our sponsors. We do not permit these companies to use your personally identifiable information without your permission for any purpose other than to send you information about their own products and services.
