The latest news and information on semiconductor lithography, including optical, EUV, e-beam, nanoimprint, maskless and other lithography techniques; exposure tools; resists; and masks/templates.
Cymer Hitting Its EUV LPP Source Goals David Lammers, News Editor - 11/12/2008
Cymer said it is running its laser-produced plasma (LPP) EUV source for eight hours at a time at 50 W of pulsed power. By the end of the year, Cymer expects its source to generate 100 W of sustained power during the time of the exposure of the die, enough power for the pre-production EUV tools expected next year from the major scanner manufacturers, said David Myers, vice president of Cymer’s EUV source program. More
FSI Receives Repeat Polaris Order From GaAs Foundry Staff - 11/19/2008
Orders within the broadband wireless and wireline communications device suppliers are expected to increase, with FSI placing emphasis on continued expansion into this key market.
More
Advancements in EUV Optics Technology Takaharu Miura and Katsuhiko Murakami, Nikon Corp.; Holly Magoon and Andrew Barada, Nikon Precision Inc.; Martin McCallum, Nikon Precision Europe - 11/01/2008
Extreme ultraviolet lithography (EUVL) is the most likely lithography solution at 22 nm half-pitch and beyond. The transition to EUVL presents significant challenges in the areas of projection and illumination optics, as well as contamination control, but marked improvements have been made in these areas.
More
IMEC Calls EUV Performance ‘Impressive’ Laura Peters, Editor-in-Chief - 10/23/2008
After only five months’ experience with a new source on its Alpha Demo Tool (ADT), Kurt Ronse, director of the Advanced Lithography Program at IMEC (Leuven, Belgium), said he is impressed with the extreme ultraviolet (EUV) tool’s stability and performance to date. IMEC has demonstrated the ability to resolve 35 nm flash patterns with the scanner.
More
ASML Presents Faster ArF Scanner, Says EUV on Track for 2010 Laura Peters, Editor-in-Chief - 10/20/2008
ASML said it is on schedule for 2010 delivery of its first EUV production system. At a research review meeting in Veldhoven, ASML introduced a new positioning measurement system to improve overlay control by 50% to <2 nm for a Twinscan immersion system.
More
Kovio Demonstrates RFID Tags Using Printed Electronics David Lammers, News Editor - 10/16/2008
Kovio Inc. (Milpitas, Calif.) announced today at a conference in Chicago that it is demonstrating RFID tags based on its printed ICs (PICs). The startup is getting ready to begin manufacturing at its Milpitas fab, using nine electronics-use inks that it developed internally. “Printed electronics is no longer a vision — it is here,” said CEO Amir Mashkoori.
More
Mapper to Ship E-Beam Lithography System to TSMC Staff - 10/13/2008
Mapper Lithography (Delft, Netherlands) will ship its first 300 mm multi-column e-beam maskless lithography platform to TSMC for 22 nm process development and device prototyping. “Mapper’s technology holds great promise for cost-effective manufacturing at 22 nm and beyond,” said Jack Sun, vice president of R&D at TSMC.
More
Mapper Lithography Names Hegarty as CEO Staff - 10/10/2008
Maskless lithography startup Mapper Lithography (Delft, Netherlands) named Christopher Hegarty as its new CEO, succeeding Boudewijn Baud. Mapper’s approach uses a MEMS array to control parallel electron beams.
More
Views on News David Lammers, News Editor, Semiconductor International October 23, 2008 When Is No Really a No?
An executive at a major IC manufacturer likes to tell the story about a meeting in 19... More
Plug in and get the latest SI news, trends and industry updates delivered directly to your inbox!
Technical Articles
Advancements in EUV Optics Technology Takaharu Miura and Katsuhiko Murakami, Nikon Corp.; Holly Magoon and Andrew Barada, Nikon Precision Inc.; Martin McCallum, Nikon Precision Europe, 11/01/2008
Extreme ultraviolet lithography (EUVL) is the most likely lithography solution at 22 nm half-pitch and beyond. The transition to EUVL presents significant challenges in the areas of projection and illumination optics, as well as contamination control, but marked improvements have been made in these areas....
Looking for Truth in Conferences Aaron Hand, Executive Editor, Electronic Media, 09/01/2008 Autumn is a busy conference time for the lithography world — one piled on top of another as we make our way through September and October. But it has become increasingly difficult to attend conferences and still avoid the plethora of corporate motivational speeches....
Self-Aligned Double Patterning Gains NAND Flash Favor Chris Bencher, Applied Materials Inc., Santa Clara, Calif., 09/01/2008 Whether you call it frequency doubling, pitch reduction, spacer mask patterning or SADP, sidewall spacer transfer patterning techniques are being adopted at an accelerating rate by NAND flash device makers. This article describes the generic process flows and demonstrated capabilities of the technique....
View All Stories
More Videos >>
Advancements in EUV Optics Technology
