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Combining AOI and x-rays for greater flexibility

Steve Scheiber, Contributing Technical Editor -- Test & Measurement World, 2/1/2005

 
The X8051 combines x-ray technology with automated optical inspection techniques and handles board sizes up to 22x28 in.
Courtesy of Viscom.
Critical to any "test" strategy, including inspection, is selecting the right capital equipment. Where a single piece of test equipment can provide a range of capabilities, such as in-circuit, functional, and boundary-scan testing, for example, most inspection systems offer only a single solution.

To address this challenge, Viscom AG has introduced the X8051, an inspection system that combines 2-D and 3-D x-ray imaging capability with automated optical inspection (AOI). The company claims that no other system offers as many different inspection tools in one box.

Viscom developed the X8051 to meet manufacturers' needs for manual, semi-automatic, and fully automatic inspection and for both in-line and off-line operation. Its x-ray section detects typical faults on BGAs, surface-mount, and other components that hide their solder joints, and it can handle board sizes up to 22x28 in. The system even inspects lead-free solders, a feature that is becoming increasingly important.

Field of view

Read other articles from this Machine-Vision & Inspection Test Report:

Combining AOI and x-rays
   for greater flexibility

The world is analog
Inspecting the future
A common environment simplifies application development
For optical inspection, users get standard CCIR sensors (camera modules) or megapixel modules. Field-of-view ranges from 4x5 mm to 15x21 mm. The narrow field allows users to perform comprehensive inspection, looking for subtle problems such as solder bridges and other small solder shorts.

The wider field lets users detect more obvious faults such as large solder shorts and whether a component is present, absent, or out of position. A rotating conveyor allows the system to inspect objects in line at angles up to 70 degrees, reducing false failures caused by mispositioning of the board under inspection.

Since the goal was to accommodate a wide range of inspection strategies, the system also permits 3-D imaging using either computer tomography (software reconstruction of a 2-D image to convey 3-D information) or laminography ("slicing" the component or board at different heights to construct a 3-D image). Other available tools include proprietary image processing and analysis, an interface that permits connection to a repair or programming station or an SPC server, and links to bar-code and data-matrix scanners for better product traceability.

By combining x-ray techniques with AOI on one system, Viscom has given customers more "bang for the buck." Also, for contract manufacturers and others who must accommodate a high product mix, a rapid changeover, and the unpredictability of what's coming next, this combined system makes it easier to modify an inspection strategy without the need to purchase additional hardware.

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