Show Highlights

Productronica, November 15–18, Munich, Germany, sponsored by Messe München, www.productronica.de.

The Model 1550 x-ray inspection system combines large-board inspection with automated motion control, measurement, and analysis. Courtesy of VJ Electronix.

MVP (www.machinevisionproducts.com) displayed its high-speed AutoInspector Ultra II wire-bond inspection system. VJ Electronix (www.vjelectronix.com) exhibited its Model 1550 x-ray inspection system, which combines large-board (18x24-in.) inspection with automated motion control, measurement, and analysis.

Leica Microsystems (www.leica.de) highlighted its DM2500 M for inspecting circuit-board cross sections. ViTechnology (www.vitechnology.com) demonstrated five of its Vi-3K AOI systems, using different hardware and software configurations to show how the systems can be adapted for use at various stages of the PCB assembly line. X-Tek (www.xtekxray.com) highlighted its Revolution real-time microfocus x-ray system, which offers viewing angles of up to 75°.

Phoenix|x-ray (www.phoenix-xray.com) debuted its microme|x x-ray system for inspecting PCB assemblies. Everett-Charles Technologies' ATG Test Systems division (www.ectinfo.com) demonstrated the Eliminator integrated flying-probe test cell for high-throughput electrical measurements. The system handles conventional PCB panel test, IC package test, and PCB inner-layer electrical test. BP Microsystems (www.bpmicro.com) highlighted a single-lane tube feeder and loader and a 2-D inspection option for its device-programming systems.

Digitaltest (www.digitaltest.com) introduced the Lambda concurrent in-circuit/functional test system and described PXI functional test enhancements and a new fixture-lifting mechanism for its MTS300 hybrid test system. Goepel electronic (www.goepel.com) launched a series of low-cost boundary-scan controllers that will complement its high-performance ScanFlex line. Seica (www.seica.com) announced several new and enhanced products within its VIVA Integrated Platform, including the Strategy.sl automated in-circuit/functional bed-of-nails tester, the Pilot VIP automated flying-probe tester for loaded boards, and the S24 BBT flying-probe tester for bare boards.

JTAG Technologies (www.jtag.com) demonstrated its recently introduced Gigabit Ethernet-compatible TapCommunicator, which is based on the TapSpacer technology from Patria Advanced Solutions (www.patria.fi). Dage Precision Industries (www.dage-group.com) introduced its 4000HS high-speed bond tester for measuring solder-bond reliability.

FineTech (www.finetech.de) highlighted its FinePlacer Micro HVR system for high-volume rework applications. Pickering Interfaces (www.pickeringtest.com) introduced an LXI switching chassis and power sequencer as well as PXI amplifiers and attenuators. Rohde & Schwarz (www.rohde-schwarz.com) introduced version 2.3 of its enhanced generic test software library (EGTSL) for its CompactPCI/PXI test platform and also announced that it has optimized its new NGPL6/5 quadruple programmable power supply for mobile-phone production-line final test.

Vision 2005, November 8–10, Stuttgart, Germany, produced by Messe Stuttgart, www.messe-stuttgart.de/vision.

During Vision 2005, the German Machine Vision Association (VDMA; www.vdma.de) presented its latest market research, which forecasts that the market will exceed 1 billion euros by year's end. Exports, along with machine-vision consumption in the automotive and electronics and electrical industries, are expected to fuel growth through 2006 to just under 1.1 billion euros.

The newly formed European Machine Vision Association (EMVA; www.emva.org) also presented positive forecasts as well as two new industry standards. EMVA 1288, "Standard for Characterization and Presentation of Specification Data for Image Sensors and Cameras," is an initiative for defining a unified method for measuring, computing, and presenting specification parameters for cameras and image sensors used for machine-vision applications. The goal is to make it easier for customers to compare products from different manufacturers.

The second standard, GenlCam Standard, aims to provide a generic programming interface for all kinds of cameras. The EMVA says that no matter what interface technology is being used, such as GigE Vision or Camera Link, the application programming interface (API) should be always the same.

On the exhibit floor, which included more than 200 exhibitors from 19 countries. intelligent cameras dominated. Basler Vision Technologies (www.basler-vc.com) offered the eXcite intelligent camera and an embedded version of the MVTec HALCON software library. Celebrating its 10th anniversary, Vision Components (www.vision-components.com) presented 14 new smart cameras ranging from the VC2065 (½-in. CCD, 782x582, 45 frames/s, SVGA video output) to the VC4472 (1¹/₈-in. CCD, 1600x1200, 1-GHz DSP).

XenICs (www.xenics.com) presented the XEVA-FPA-320, a digital, software-configurable camera consisting of a 320x256 thermo-electrically cooled InGaAs array combined with control and communication electronics. SICK/IVP (www.sickivp.com) unveiled the IVC-2D and IVC-3D smart cameras and the Ruler E, which combines a camera with a built-in laser and optics for a predefined field of view.

Distributor Stemmer Imaging (www.stemmer-imaging.de) showcased products from DVT, Cognex, Pleora, and IPD. The company also exhibited its own Common Vision Blox software library for image processing. MVTec Software (www.mvtec.com) announced HALCON 7.1 for smart cameras; the new version of the software is being employed in cameras from manufacturers such as Sony, Philips, and Basler.

Pleora Technologies (www.pleora.com) announced GigE connectivity solutions with PC driver architecture for Ethernet connectivity and data flow. Philips Applied Technologies (www.apptech.philips.com/industrialvision) demonstrated the Inspector, an easy-to-use, smart-sensor system. The camera is preprogrammed, so users need to follow just five easy steps to get a system up and running.

Cypress Semiconductor (www.cypress.com) demonstrated its family of CMOS image sensors for machine-vision and motion-analysis applications. Schott Optics (www.us.schott.com/fiberoptics) displayed a line of fiber-optic light sources for machine-vision, microscopy, sensing, imaging, and automotive applications. Redlake MASD (www.redlake.com) displayed the MegaPlus II machine-vision camera for flat-panel and plasma-display-panel inspection. NeuroCheck (www.neurocheck.com) demonstrated the NeuroCheck image-processing software, a program that supports matrix and line-scan cameras in both monochrome and color formats.

International Test Conference, November 8–10, Austin, TX, sponsored by the IEEE, www.itctestweek.org.

Cadence Design Systems (www.cadence.com) highlighted two Encounter Test enhancements. True-Time for bridges allows users to automatically generate delay tests that target the bridging faults common in nanometer designs. True-Time through RAM generates delay tests into and through nonscannable elements, including third-party RAMs.

Synopsys (www.synopsys.com) described enhancements to TetraMAX that provide designers with productivity gains for both automatic test-pattern generation and test-debugging tasks. Mentor Graphics (www.mentor.com) highlighted its new YieldAssist diagnostic tool, which is designed to quickly identify and isolate yield-limiting defects. Magma Design Automation (www.magma-da.com) demonstrated its Blast DFT, which features memory-BIST capabilities for 90- and 65-nm designs, including self-repair and routing-friendly architecture.

The MS5205 is designed for testing semiconductor memories. Courtesy of Mosaid Technologies.

Mosaid Technologies (www.mosaid.com) unveiled its MS5205 sixth-generation test system targeted at engineering test, analysis, and bitmapping applications for semiconductor memories. Goepel electronic (www.goepel.com) introduced another I/O module for the ScanFlex boundary-scan hardware platform. The SFX1149.4 provides resources for the test of analog circuits based on the IEEE 1149.4 analog boundary-scan standard.