Nepcon China focuses on manufacturing prowess

Rick Nelson, Chief Editor -- Test & Measurement World, 4/6/2006 8:08:00 AM

SHANGHAI, CHINA. China may be well on the way to becoming a design powerhouse, but Nepcon China
(www.nepconchina.com, April 4-7) helped reinforce China's reputation as the world's factory floor, at least with respect to electronic printed-circuit boards and subassemblies. Only one exhibit fully addressed electronic design: Asset InterTech (www.asset-intertech.com) was on hand to emphasize the importance of boundary-scan design-for-test tools.

Emphasizing China's importance as a manufacturing powerhouse, Aeroflex and Anritsu, known in North America for their wireless communications test expertise, were demonstrating manufacturing tools: Aeroflex (www.aeroflex.com) highlighted its 4250 manufacturing test system, while Anritsu (www.anritsu.com) demonstrated its MK5400 solder-paste inspection system.

Many vendors enlisted the aid of complementary organizations to present their message to a Chinese audience. BP Microsystems (www.bpmico.com) highlighted its ISP-PRO device-programming socket module in conjunction with Wong's Kong King International Holdings Ltd. (www.wkkintl.com/). Also under the WKK banner, Phoenix|x-ray (www.phoenix-xray.com) presented its Microme|x sub-micron high-resolution semiautomatic x-ray system for the inspection of solder joints and electronic devices. VJ Electronix (www.vjelectronix.com) presented a paper on addressing rework challenges in lead-free processes and, in the WKK booth, displayed its Summit 1800 rework system. Hosted by American Tec (www.autroncorp.com/co.html), ViTechnology (www.vitechnology.com) presented its Vi-5000 Series AOI machines. In addition, SZ Testsysteme (a division of Credence Systems, www.credence.com), Aehr Test Systems (www.aehr.com), and Scorpion Technologies, www.scorpion-tech.com all exhibited under the www.jointech.com.cn/ banner.

In other Nepcon China test-and-inspection news:

• Agilent Technologies (www.agilent.com) demonstrated versions of its Medalist in-circuit test systems and Medalist 5DX automated x-ray inspection systems.
• Viscom (www.viscom.de) demonstrated products including its X8011 inline-capable x-ray inspection system.
• Machine Vision Products (www.visionpro.com) demonstrated its GEM inspection system.
• X-Tek Systems (www.xtekxray.com) highlighted its Linx compact x-ray system for BGA, flip chip, PCB layer alignment, and general surface-mount inspection, and it presented its Revolution x-ray inspection system.
• Teradyne (www.teradyne.com) displayed its XStation 3-D x-ray imaging system.
• Elektrobit (www.elektrobit.com) featured its Tiny Test Handler, which includes a two-level conveyor that accommodates compact layouts for functional test, boundary-scan test, and software-download applications.
• TRI (www.tri.com.tw) displayed products such as its TR7006L 3-D solder paste system and TR7500DT desktop AOI system.
• Hamamatsu (www.hamamatsu.com) highlighted its microfocus x-ray sources and camera units.
• CyberOptics (www.cyberoptics.com) presented products such as its Flex AOI system.
• Omron (www.omron.com) displayed AOI systems for PCB inspection applications.
• Seica (www.seica.com) highlighted its flying-probe and other PCB test systems.
• Digitaltest (www.digitaltest.net) showcased its MTS180 board-test system, which can be equipped with a press-down unit and a combination of analog and hybrid in-circuit test pins.
• YESTech (www.yestechinc.com) highlighted its lineup of AOI and AXI systems.