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An IC DFM vendor sampler

Rick Nelson, Chief Editor -- Test & Measurement World, 6/6/2006 6:02:00 AM

Point-tool vendors with a claim to the "design for manufacturing" (DFM) label might offer products embodying optical proximity correction (OPC) and resolution enhancement technology (RET), or they might provide design-rule-checking (DRC) tools, timing and power optimization packages, lithography simulators, or yield measurement and analysis tools. Below is a sampling of integrated-circuit DFM point-tool vendors, products, and technologies. Updated August 24, 2006.

Read related commentary here.
Find links to recent DFM coverage in Reed Electronics Group publications here.

Company Product and technology
Anchor Semiconductor
http://www.anchorsemi.com/
NanoScope-PRV OPC/RET inspection tool; NanoScope-DFP manufacturing-aware design verification tool, which is used at pre-tapeout and is complementary to DRC to ensure lithographic-friendly layout; NanoScope-YAM full-chip design-based hot-spot analysis tool.
Aprio Technologies
http://www.aprio.com/
Halo-iOPC, incremental OPC.
Blaze DFM
http://www.blaze-dfm.com
Blaze MO, which performs power and timing optimization of a finished design just prior to the handoff to manufacturing.
Brion Technologies
http://www.brion.com/
Tachyon, a hardware-accelerated, image-based data and lithography simulation engine for full-chip RET.
Clear Shape Technologies
http://www.clearshape.com/
Model-based DRC tool.
Extreme DA
http://www.extreme-da.com/
EDA design tools for modeling IC variations and analyzing the statistical impact on extraction, timing, noise, and power to facilitate parametric yield measurement and optimization,
Nannor Technologies
http://www.nannor.com
Acuma, a post routing optimization tool that implements recommended design rules for manufacture closure and that optimizes layout for yield improvement.
Ponté Solutions
http://www.pontesolutions.com/
Yield modeling and yield analysis.
Predictions Software
http://www.icyield.com/
EYES, a tool for making integrated circuit yield predictions; PEYE-CAA, which provides the ability to generate and display critical areas of an IC layout; PEYE, a layout modification/analysis tool for the automation of yield and reliability enhancement.
Pyxis Technology
http://www.pyxistech.com/
SOC routing software for sub-100-nm processes that targets yield, lithography, and manufacturability at the design phase.
Sagantec
http://www.sagantec.com/
SiFix, which detects and corrects physical violations in technology and reliability design rules; XTREME, which re-engineers chip interconnect wires to reduce coupling capacitance, crosstalk, and critical net loads to enhance signal integrity, reliability, and yield; and DFM-Fix, a tool that automatically optimizes design tape-out data to eliminate lithography related hot spots.
Sigma-C
http://www.sigma-c.com/
Solid+ microlithography simulator for design and OPC.
Silicon Design Systems
http://www.silicon-value.com
K-Route placement-independent interconnect synthesis, which simultaneously uses routing, extraction, analysis and optimization engines.
Stratosphere Solutions
http://www.stratosol.com
StratoPro, IP that supports DFM and DFY through process characterization.
Virage Logic
http://www.viragelogic.com
FirstPass-Silicon Characterization Lab, which helps ensure reliable IP across a range of foundries.
XYALIS
http://www.xyalis.com/
Software targeting design for manufacturing and mask preparation.

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