Conference to cover reliability testing for RoHS lead-free electronics
-- Test & Measurement World, 2/15/2007 9:00:00 AM
IPC/JEDEC has announced that it will hold the Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics conference from April 10 to 12 in Boston, MA. In addition to the technical program and exhibits, there will also be a day of workshops and educational sessions.
The technical sessions will be held on April 10 and 11 and will cover a range of reliability topics, such as predicting the fatigue life of lead-free solder interconnects, using x-ray inspection on lead-free solder joints, and using a ball-impact test to evaluate Sn-3.5Ag-based solder joints. Other sessions will offer a comparison of lead-free solders and will cover the moisture absorption effects of lead-free reflow processing on Tantalum SMD capacitor reliability. Attendees will be able to visit tabletop exhibits during conference breaks.
The educational courses and workshops, which are scheduled for April 12, will discuss how to craft a lead-free solder process, how to specify PCBs for lead-free assembly, and how to decide if lead-free processes are reliable enough for harsh environments.
